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MSC ETE-GLX3

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Description

The design of the MSC ETE-GLX3 module is based on the AMD LX800 @ 0.9W processor combined with the AMD Geode™ CS5536 Companion Chip. It offers a rich feature set in combination with entry level PC performance and lowest power requirements. Two IDE interfaces and onboard SATA according to ETX 3.02 specification offer broadest storage capabilities.

  • 95x114
  • 5.5 W
  • Entry

AMD® LX800 @ 0.9W Processor (500MHz)

Companion Chip AMD Geode™ CS5536

Up to 1 GB DDR SDRAM

CompactFlash Slot

Two SATA interfaces

Two PATA interfaces

Integrated LCD TFT graphics (LVDS and TTL options)

PCI Bus

ISA Bus (Subset)

Technical Data - MSC ETE-GLX3

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Technology

x89

Formfactor

ETX

CPU

AMD Geode™ LX800

Chipset

AMD Geode™ CS5536

RAM

up to 1 GB DDR, 200-pin SO-DIMM

Storage Interfaces

2x SATA 1.5 Gb/s;
2 x Enhanced IDE ports (ATA/UDMA100), one shared with CompactFlash socket;
1x CompactFlash socket (Type I)

USB

4x USB V2.0

Serial Interfaces

2x COM (TTL), IrDA
I²C Bus
SMBus

Bus Interfaces

ISA Bus Subset (no ISA Bus Master, no DMA operation; 16-bit bus operations are executed as a sequence of two 8-bit operations)
PCI Bus, 32 Bit, 33 MHz

Display Controller

Integrated LCD TFT Graphics Controller

Display Memory

UMA, up to 256 MB

Display Interfaces

Analog up to 1920 x 1440,
Options: LVDS 18 bit single channel / LVDS 24 bit dual channel / TTL; up to 1600 x 1200

Network Interface

10/100 Base-T

Audio Interface

AC´97 Audio Interface

Miscellaneous

Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
3-pin header (5V)
RTC battery: external
System Monitoring:
voltage, temperature

Feature Highlights

Lowest-power AMD Geode preocessor; passive cooling

Firmware

Insyde XpressROM BIOS

OS Support

BSP for Windows XP (embedded)
BSP Windows CE on request
BSP for Linux on request

Power Requirement

+5V +/-5%, 5V Stby optional,
10W typ.

Environment

Ambient Temperature;
0° … 60°C (operating),
-25° … 85°C (storage)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)

Dimensions

114mm x 95mm

Certificates

UL / CE

Cooling

Heatspreader with non-threaded or threaded standoffs

Carrier

Base board in ATX form factor;
Base board in PISA form factor

Memory

DDR SODIMM 512MB
DDR SODIMM 1GB

Order Reference - MSC ETE-GLX3

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Order No. Description Reference Status  
32253 ETX 3.0 compatible CPU module (95x114mm) based on AMD ""Geode"" LX800 CPU at 500 MHz; 2x IDE, 2x SATA; integrated UMA graphics; LCD interface (LVDS); Ethernet controller (10/100Base-T); AC97 audio; 4x USB 2.0, Suspend to RAM; slot for DDR SODIMM module; CompactFlash slot; Price w/o CompactFlash MSC ETE-GLX3-CPU500-249000 PCBFTX PV
32327 ETX 3.0 compatible CPU module (95x114mm)based on AMD "Geode" LX800 CPU at 500 MHz; 2x IDE, 2x SATA; integrated UMA graphics; LCD interface (Dual-/Single-LVDS); Ethernet controller (10/100Base-T); AC97 audio; 4x USB 2.0, Suspend to RAM; slot for DDR SODIMM module; CompactFlash slot; Price w/o CompactFlash MSC ETE-GLX3-CPU500-219000 PCBFTX OR
32284 ETX 3.0 compatible CPU module (95x114mm)based on AMD "Geode" LX800 CPU at 500 MHz; 2x IDE, 2x SATA; integrated UMA graphics; LCD interface (TTL); Ethernet controller (10/100Base-T); AC97 audio; 4x USB 2.0, Suspend to RAM; slot for DDR SODIMM module; CompactFlash slot; Price w/o CompactFlash MSC ETE-GLX3-CPU500-289000 PCBFTX PV
PV = Preferred variant; OR = on Request (in OEM quantities only)
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Carrier Options

Order No. Description Reference
31635 Base board in ATX form factor MSC ETE-MB-ATX PCBFTX
32351 ETE/ETX base board in PISA form factor also usable as stand-alone base board for evaluation and small series production MSC ETE-MB-PISA PCBFTX

Cooling Options

Order No. Description Reference
24899 Heatspreader for ETe-GLX, consisting of a specially formed aluminum plate with 2.5mm mounting holes with female thread, distance holders, screws and grommets as well as two thermopads for the thermal contact to CPU and chipset MSC ETE-GLX-01 HSP-001 BRDMON
25916 Heatspreader for ETe-GLX, consisting of a specially formed aluminum plate with 3 mm mounting holes with femal thread, distance holder, screws and grommets as well as wo thermopads for the thermal contact to CPU and chipset
MSC ETE-GLX-02 HSP-001 BRDMON

Memory Options

Order No. Description Reference
1085111 DDR1 SODIMM 1GB, PC333 128Mx64, 64Mx8 based, 2rank, CL2,5, FBGA MSC1S1G333B3-HEE3
1088357 DDR1 SODIMM 512MB, PC333 64Mx64, 64Mx8 based, 1rank, CL2,5, FBGA. MSC1S512333B2-HEE

Sales Contact

direct: ( 650 ) – 616 4068
info@mscembedded.com