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MSC ETE-A945GSE
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MSC ETE-A945GSE
Intel® Atom™
Description
- 95x114
- 10 W
- Entry/Medium
Intel®Atom™ N270 (1.6GHz)
Mobile Intel®945GSE Chipset with integrated Intel®Graphics Media Accelerator 950
Up to 2GB DDR2 SDRAM
LVDS interface (24 Bit, dual channel) up to 1920 x 1200
2nd LVDS interface via on-board connector (optional)
CRT interface up to 2048 x 1536
Dual Independent Display supported
Six USB 2.0 interfaces
Technical Data - MSC ETE-A945GSE
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Technology
x86
Formfactor
ETX
CPU
Intel© Atom N270
Chipset
Intel© 82945GSE, ICH7DH
RAM
up to 2GB DDR2 (PC4200), 1x 200-pin SO-DIMM
Storage Interfaces
2 x SATA 3Gb/s;
2 x Enhanced IDE ports (ATA/UDMA100)
USB
6x USB 2.0
Serial Interfaces
2x COM (TTL), IrDA
I²C Bus
SMBus
Bus Interfaces
ISA Bus (PCI/ISA Bridge ITE 8888)
PCI Bus, 32 Bit, 33 MHz
Display Controller
Intel Graphics Media Accelerator 950
Display Memory
UMA, up to 384 MB
Display Interfaces
Analog up to 2048x1536,
1x LVDS 18/24 bit, dual channel, up to 1600 x 1200
1x LVDS interface 18 Bit, on on-board connector (option)
Network Interface
10/100 Base-T
Audio Interface
ACï97 Audio Interface
Miscellaneous
Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
3-pin header (5V)
RTC battery: external
System Monitoring:
voltage, temperature, CPU fan
Feature Highlights
Low-power Atom processor
Firmware
Phoenix TrustedCore BIOS
OS Support
BSP for Windows XP (embedded)
BSP for Linux on request
USPEPC (HW Programming Interface)
Power Requirement
+5V +/-5%, 5V Stby optional,
8W typ. (N450) - 15W typ. (D510)
Environment
Ambient Temperature;
0° … 60°C (operating),
-25° … 85°C (storage)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions
114mm x 95mm
Certificates
UL / CE
Cooling
Passive heat sink
Heat spreader with threaded or non-threaded standoffs
Carrier
Base board in ATX form factor;
Base board in PISA form factor
Memory
DDR2 SODIMMS 512MB, 1GB or 2GB
Order Reference - MSC ETE-A945GSE
| Order No. | Description | Reference | Status | |
| 32391 | ETX 3.0 compatible CPU module (95x114mm) based on Intel Atom N270 at 1.60GHz, 512kB L2;integrated UMA graphics; LCD interface (LVDS); Ethernet controller(10/100Base-T); AC97 audio; PCI/ISA bridge; 2x Mini-USB connector; 2x SATA connector; slot for DDR2 SODIMM memory module | MSC ETE-A945GSE-N270-0300 PCBFTX | PV |
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PV = Preferred variant; OR = on Request (in OEM quantities only)
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Carrier Options
| Order No. | Description | Reference |
| 31635 | Base board in ATX form factor | MSC ETE-MB-ATX PCBFTX |
| 32351 | ETE/ETX base board in PISA form factor also usable as stand-alone base board for evaluation and small series production | MSC ETE-MB-PISA PCBFTX |
Cooling Options
| Order No. | Description | Reference |
| 1073416 | Passive heatsink solution for ETE-A945GSE, consisting of a single-piece aluminum profile with fins, M2.5 distance holders, screws, grommets and two thermopads for the thermal contact to CPU and north bridge. No fan, no SO-DIMM cutout. | MSC ETE-A945GSE-02 HSI-001 |
| 1073444 | Heatspreader for ETE-A945GSE, consisting of a specially formed aluminum plate with M2.5 distance holders, screws, grommets and two thermopads for the thermal contact to CPU and north bridge. 6 holes for countersun screws allow mounting of a heatsink on top. No SO-DIMM cutout. | MSC ETE-A945GSE-01 HSP-001 |
| 1073643 | Heatspreader for ETE-A945GSE, consisting of a specially formed aluminum plate with with pressed in distance holders (3mm inner diameter), distance holders, screws, grommets and two thermopads for the thermal contact to CPU and north bridge. 6 holes for countersunk screws allow mounting of a heatsink on top. No SO-DIMM cutout. |
MSC ETE-A945GSE-02 HSP-001 |
Memory Options
| Order No. | Description | Reference |
| 1051494 | DDR2 SODIMM, 1GB, PC800, 128Mx64, 1.8V, 2rank based on 64Mx16 | HYMP112S64CP6-S6 |
| 1051595 | MoviNand, 2GB, 16Gbx1 | AKG0000M-B998 |
| 1054514 | DDR2 SODIMM,512MB,64Mx64,unb.,PC667,CL4, 1rank | HYMP164S64CP6-Y5-C |
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