direct: ( 650 ) – 616 4068
info@no-spam.mscembedded.com
Intel® Atom™ N270 (1.6GHz)
Mobile Intel® 945GME Chipset with integrated Intel® 950
Up to 2GB DDR2 SDRAM
Two SATA-150 mass storage interfaces
10 / 100 / 1000 Base-TX Ethernet interfaces
LVDS interface (18 / 24 / 36 / 48 Bit) up to 1600 x 1200
CRT interface up to 2048 x 1536
Dual Independent Display supported
Five PCI Express™ x1 lanes
Eight USB 2.0 interfaces
Infineon TPM 1.2
x86
COM Express Basic
Intel Atom N270
Intel 82945GME, ICH7DH
up to 2GB DDR2 SDRAM (PC4200), 1x 200-pin SO-DIMM
2x SATA 1.5Gb/s,
1x Enhanced IDE port (ATA/UDMA100)
8 x USB 2.0
5x PCI Express x1,
PCI Bus, 32bit, 33 MHz, 4 slots supported,
LPC bus (Low Pin Count bus)
Intel Graphics Media Accelerator 950
UMA, up to 384MB
Analog up to 2048x1536,
LVDS 18/24 bit, dual channel, up to 1600 x 1200
10/100/1000Base-TX
High Definition Audio
TPM 1.2
Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
3-pin header (12V), speed control,
RTC battery: external
System Monitoring:
voltage, temperature, CPU fan
Low power consumption; Graphics performance
Phoenix TrustedCore BIOS
Windows 7 (embedded)
BSP for Windows XP (embedded)
BSP for Linux on request
USPEPC (HW Programming Interface)
+12V+/-10%, 5V Stby optional,
8 W typ.
Ambient Temperature;
0° … 60°C (operating),
-25° … 85°C (storage)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
125mm x 95mm
UL / CE
Passive heat sink
Active heat sink with fan
Heat spreader
Carrier board in MiniITX form factor;
Evaluation board
DDR2 SODIMMS 1GB or 2GB
| Order No. | Description | Reference | Status | |
| 32365 | COM Express Basic compatible CPU module (95x125mm)Module based on Intel Atom N270 at 1.60 GHz;945GME chipset; integrated UMA graphics; LCD interface (LVDS); Ethernet controller (10/100/1000 Base-T); TPM;slot for DDR2-533 SODIMM memory module; AC97 audio; 5x PCIe x1, PCIe x16 | MSC CXB-A945M-N270-060000 PCBFTX | PV |
| Order No. | Description | Reference |
| 32367 | COM Express Industrial Platform with PCI and PCI Express x1 | MSC CX-MB-IP1 PCBFTX |
| Order No. | Description | Reference |
| 1073524 | Passive heatsink solution for CXB-A945M, consisting of a single-piece aluminum profile with longitudinal fins, distance sleves (2.7mm inner diameter), screws and thermopads. No fan, no SO-DIMM cutout. | MSC CXB-A945M-01 HSI-001 |
| 1073525 | Heatspreader for CXB-A945M, consisting of aluminum plate with distance sleeves (5 x 2.7), 3 aluminum blocks for thermal connection to thermal active devices and thermal pads. | MSC CXB-A945M-01 HSP-001 |
| 1073534 | Passive heat sink for CXB-CD945, CD9455, A945M with spring mounted self aligning cooler elements contacting the thermal active devices. Aluminum plate withdistance sleves (2.7mm inner diameter), screws and thermopad for the south bridge. No Fan. | MSC CXB-945GM-02 HSI-001 |
| 1073535 | Active Heatsink for CXB-CD945, CD9455, A945M with spring mounted selfaligning cooler elements connecting the component die. Aluminium plate withdistance sleves (2.7mm inner diameter), screws and thermopad for the southbridge. Speed controlled fan (YS type) with connector to the CPU module. |
MSC CXB-945/915GM-01 HSF-003 |
| 1073536 | Active Heatsink for CXB-CD945, CD9455, A945M with spring mounted selfaligning cooler elements connecting the component die. Aluminium plate withdistance sleves (2.7mm inner diameter), screws and thermopad for the southbridge. Speed controlled fan (EF type) with connector to the CPU module. |
MSC CXB-945/915GM-01 HSF-004 |
| Order No. | Description | Reference |
| 1050983 | DDR2 SODIMM, 1GB, PC667, 128Mx64, 1.8V, 64Mx16 based, 2rank | HYMP112S64CP6-Y5 |
| 1050984 | DDR2 SODIMM, 2GB, PC667, 256Mx64, CL5, 1.8V, FBGA, 128Mx8 based, 2rank | HYMP125S64CP8-Y5 |
| 1051494 | DDR2 SODIMM, 1GB, PC800, 128Mx64, 1.8V, 2rank based on 64Mx16 | HYMP112S64CP6-S6 |
direct: ( 650 ) – 616 4068
info@no-spam.mscembedded.com
