direct: ( 650 ) – 616 4068
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Intel® Celeron® 807UE (single-core, 1.0GHz),
Intel® Celeron® 827E (single-core, 1.4GHz),
Intel® Celeron® 847E (dual-core, 1.1GHz),
Intel® Celeron® B810E (dual-core, 1.6GHz),
Intel® Core™ i3-2310E (dual-core, 2.1GHz),
Intel® Core™ i5-2515E (dual-core, 2.5GHz),
Intel® Core™ i7-2610UE (dual-core, 1.5GHz),
Intel® Core™ i7-2655LE (dual-core, 2.2GHz),
Intel® Core™ i7-2715QE (quad core, 2.1GHz)
Intel® HD Graphics 2000 / 3000
Intel® QM67 or HM65 PCH
Up to 16GB DDR3 SDRAM, dual channel
Four SATA-300, one PATA mass storage interfaces
LVDS (24 Bit, dual channel) and CRT interface
Resolution up to 2560 x 1600
Five PCI Express™ x1 lanes
Eight USB 2.0 interfaces
UEFI Firmware
x86
COM Express Basic
Intel i3, i5, i7, Celeron CPUs
Intel 6-Series Platform Controller Hub
up to 16GB DDR3 (1066/1333), 2x 204 pin SO-DIMM, dual channel
SSD optional
4x SATA 3Gb/s;
1x Enhanced IDE (UDMA6, 133MB/s)
8 x USB 2.0
5x PCI Express x1,
1x PCI Express Graphics (PEG) x16,
PCI Bus, 32bit, 33 MHz,
LPC bus (Low Pin Count bus)
Intel HD Graphics 2000/3000
UMA, up to 384MB
Analog up to 2048x1536,
SDVO interface, single channel muxed with PEG signals,
LVDS 18/24 bit, dual channel,
3x Display Port/HDMI interfaces, muxed with PEG, up to 2560x1600
10/100/1000Base-TX
High Definition Audio
TPM 1.2
Watchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header (12V), PWM speed control,
RTC battery: external
System Monitoring:
voltage, temperature, CPU fan
DP/HDMI multiplexing
AMI Aptio UEFI
Windows 7 (embedded)
BSP for Windows XP (embedded)
BSP for Linux on request
EAPI (HW Programming Interface)
+12V+/-10%, 5V Stby optional,
25 W (typ.) up to 65 W (typ.)
Ambient Temperature;
0° … 60°C (operating),
-25° … 85°C (storage)
Humidity:
5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing)
125mm x 95mm
UL / CE
Passive heat sink
Active heat sink with fan
Heat spreader with threaded or non-threaded standoffs
Carrier board in MiniITX form factor;
Evaluation board
DDR3 SODIMMS 1GB, 2GB or 4GB
| Order No. | Description | Reference | Status | |
| 39991 | COM Express Basic module (125x95mm); based on dual-core Intel Celeron B810E at 1.60GHz, 2MB L3, 35W TDP; HM65 PCH; integrated HD Graphics 2000; Infineon TPM; various display interfaces; Gigabit Ethernet; 2x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, PCIe x16 PEG. No SSD. | MSC CXB-6S-001 PCBFTX | OR | |
| 40490 | COM Express Basic module (125x95mm); based on Celeron 847E, 1.1GHz , 2M L3, 17W TDP; HM65 PCH; integrated HD Graphics 2000; Infineon TPM; various display interfaces; Gigabit Ethernet; 2x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, PCIe x16 PEG. No SSD | MSC CXB-6S-002 PCBFTX | PV | |
| 39088 | COM Express Basic module (125x95mm); based on dual-core Intel Core i3-2310E at 2.10GHz, 3MB L3, 35W TDP; HM65 PCH; integrated HD Graphics 3000; Infineon TPM; various display interfaces; Gigabit Ethernet; 2x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, PCIe x16 PEG. No SSD | MSC CXB-6S-004 PCBFTX | OR | |
| 39090 | COM Express Basic module (125x95mm); based on dual-core Intel Core i5-2515E at 2.50GHz, 3MB L3, 35W TDP; QM67 PCH; integrated HD Graphics 2000; Infineon TPM; various display interfaces; Gigabit Ethernet; 2x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, PCIe x16 PEG. No SSD | MSC CXB-6S-005 PCBFTX | PV | |
| 39092 | COM Express Basic module (125x95mm); based on dual-core Intel Core i7-2610UE at 1.50GHz, 4MB L3, 17W TDP; QM67 PCH; integrated HD Graphics 3000; Infineon TPM; various display interfaces; Gigabit Ethernet; 2x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, PCIe x16 PEG. No SSD | MSC CXB-6S-006 PCBFTX | PV | |
| 39094 | COM Express Basic module (125x95mm); based on dual-core Intel Core i7-2655LE at 2.20GHz, 4MB L3, 25W TDP; QM67 PCH; integrated HD Graphics 3000; Infineon TPM; various display interfaces; Gigabit Ethernet; 2x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, PCIe x16 PEG. No SSD | MSC CXB-6S-007 PCBFTX | OR | |
| 39096 | COM Express Basic module (125x95mm); based on quad-core Intel Core i7-2715QE at 2.10GHz, 6MB L3, 45W TDP; QM67 PCH; integrated HD Graphics 2000; Infineon TPM; various display interfaces; Gigabit Ethernet; 2x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, PCIe x16 PEG. No SSD | MSC CXB-6S-008 PCBFTX | PV | |
| 39993 | COM Express Basic module (125x95mm); based on single-core Intel Celeron 827E 1.4GHz, 2MB L3, 17W TDP; HM65 PCH; integrated HD Graphics 2000; Infineon TPM; various display interfaces; Gigabit Ethernet; 2x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, PCIe x16 PEG. No SSD | MSC CXB-6S-009 PCBFTX | PV | |
| 41340 | COM Express Basic module (125x95mm); based on single-core Intel Celeron 807UE 1.0GHz, 1MB L3, 10W TDP; HM65 PCH; integrated HD Graphics; Infineon TPM; various display interfaces; Gigabit Ethernet; 1x socket for DDR3 SO-DIMM; HD audio; six PCIe x1, no PCIe x16 PEG. No SSD. | MSC CXB-6S-010 PCBFTX | OR |
| Order No. | Description | Reference |
| 32273 | COM Express Type 2 Evaluation board with PCI and PCI Express interfaces | MSC CX-MB-EVA2 PCBFTX |
| 39336 | Adapter board for use with MSC CX-MB-EVA2 and MSC CXB-6S/6SI; provides direct access to digital display interfaces (DisplayPort, HDMI) | MSC CX-AD-DPHDMI-R1 ES PCBES |
| 32367 | COM Express Industrial Platform with PCI and PCI Express x1 | MSC CX-MB-IP1 PCBFTX |
| Order No. | Description | Reference |
| 40152 | Passive Heatsink for CXB-6S with spring mounted self aligning cooler element connecting the processor die. | MSC CXB-6S-01 HSI-001 |
| 40661 | Heatspreader for CXB-6S, suitable for low-power Celeron processors (17W TDP) only! Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset. No fan, no SO-DIMM cutout. | MSC CXB-6S-01 HSP-001 |
| 40663 | Heatspreader for CXB-6S, suitable for low-power Celeron processors (17W TDP) only! Single-piece aluminum profile, pressed in standoffs with thread M2.5, screws and thermopads for the thermal contact to CPU and chipset. No fan, no SO-DIMM cutout. | MSC CXB-6S-02 HSP-001 |
| 40867 | Active Heatsink for CXB-6S, CXB-6SI and C6B-7S with spring mounted self aligning cooler element connecting the processor die. Extruded aluminium plate; distance sleves (2.7mm inner diameter) | MSC CXB-6S-01 HSF-001 |
| Order No. | Description | Reference |
| 1077754 | DDR3 SODIMM, 2GB/1333, 256Mx64, CL9, 256Mx8 based, 1rank, 1.5V | HMT325S6BFR8C-H9N0 |
| 1080971 | 4GB PC1333 DDR3 SODIMM 512Mx64, 204pin, 1,5V, 256Mx8 based, 2rank | NT4GC64B8HB0NS-CG |
| 1081140 | DDR3 SODIMM, 2GB, 256Mx64, PC1333 | M471B5773DH0-CH9 |
| 1085451 | DDR3 SODIMM, 1 GB,128Mx64,unb. PC1333,CL7, 128Mx8 based, 1rank, 1,5V, | HMT112S6DFR8C-H9N0 |
| 1087922 | DDR3 SODIMM 4GB PC1333 512Mx64, based on 256Mx8 2rank, 1,5V | HMT351S6CFR8C-H9N0 |
direct: ( 650 ) – 616 4068
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