MSC also offers extensive design support in addition to the most advanced and reliable technology, and so the first section of the catalog is devoted to key topics such as “Design and Production Expertise,” “Operating Systems,” and “BIOS.” Following this, all available embedded modules are listed in a “COM Modules Selector” allowing readers to quickly compare the various COM Express™, Qseven™, ETX®, EXM32 and nanoRISC® families with regard to processor type, maximum storage capacity and typical power dissipation.
The COM Express™ modules that are based on the third-generation Intel® Core™ processor family are also included in the product catalog. These modules make another leap in processing, graphics and video performance relative to earlier generation platforms. Two new COM Express™ module families are included, supporting the Type 2 (MSC CXB-6SI) or Type 6 (MSC C6B-7S) plug pin-outs. The first products integrate an Intel® Core™ i7-3615QE with 45 W maximum power dissipation (TDP) or Intel® Core™ i7-3612QE (35 W TDP) quad-core processor. Lower cost versions based on Intel® Core™ i3 and i5 dual-core processors are also available.
Also among the numerous interesting innovations featured in the current brochure are the ARM®-based embedded modules which correspond to the Qseven™ specification 1.20. The new MSC Q7-IMX6 features quad-core, dual-core or single-core Freescale Cortex-A9 i.MX6 processors providing a wide performance range and exceptional graphics capabilities. The compact Qseven™ MSC Q7-A50M platform integrates different Accelerated Processing Units (APUs) out of the Embedded G-Series from AMD. The powerful MSC Q7-TI8168 module is based on the DaVinci processor from Texas Instruments (TI) with an ARM® Cortex-A8 Core (up to 3000 DMIPS) and a digital signal processor (DSP).